NextGen Adhesives offers a complete line of electrically conductive and thermally conductive adhesives for demanding applications.

 
 
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These products are designed for high reliability and with very low ionic content. Additionally, there are a wide range of curing options to fit your needs including room temperature and snap cure.

MOST COMMON APPLICATIONS

  • EMI/RFI shielding
  • Establishment of a conductive path
  • Grounding
  • Heat management
  • Component protection
 
 
 
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Electronic Adhesive PRODUCTs

Featured
NGAC TC907-22
Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, Optical Device, Fiber Optic, TC907-22
Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, Optical Device, Fiber Optic, TC907-22

Thermally Conductive and Electrically Insulating Adhesive

Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, Optical Device, Fiber Optic, TC907-22
NGAC G907-52
Staking, Casting, Potting, Room Temperature Curable, General Purpose, NASA Outgassing, Cable Assembly, Electronics, G907-52
Staking, Casting, Potting, Room Temperature Curable, General Purpose, NASA Outgassing, Cable Assembly, Electronics, G907-52

Low Viscosity & General Purpose Epoxy Adhesive

Staking, Casting, Potting, Room Temperature Curable, General Purpose, NASA Outgassing, Cable Assembly, Electronics, G907-52
NGAC TC907-92
Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, TC907-92
Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, TC907-92

Thermally Conductive and Electrically Insulating Adhesive

Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, TC907-92
NGAC TC907-40
Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, TC907-40
Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, TC907-40

Flexible, Thermally Conductive and Electrically Insulating Adhesive

Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, TC907-40
NGAC TC907-09
Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, TC907-09
Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, TC907-09

Thermally Conductive and Electrically Insulating Adhesive

Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, TC907-09
NGAC TC907-07
Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, TC907-07
Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, TC907-07

Thermally Conductive and Electrically Insulating Adhesive

Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, TC907-07
NGAC EC907-34
Grounding, Shielding, Electrical Interconnect, Thermally Conductive, Electrically Conductive, Silver-Filled, Chip Attach, Room Temperature Curable, Medical, Electronics, NASA Outgassing, EC907-34
Grounding, Shielding, Electrical Interconnect, Thermally Conductive, Electrically Conductive, Silver-Filled, Chip Attach, Room Temperature Curable, Medical, Electronics, NASA Outgassing, EC907-34

Electrically Conductive and Room Temperature Curable Epoxy Adhesive

Grounding, Shielding, Electrical Interconnect, Thermally Conductive, Electrically Conductive, Silver-Filled, Chip Attach, Room Temperature Curable, Medical, Electronics, NASA Outgassing, EC907-34