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Posts tagged Heat Sink

NGAC TC907-22

NGAC TC907-22

Thermally Conductive and Electrically Insulating Adhesive

Electronic, Fiber OpticBeth VenutiSeptember 14, 2020Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, Optical Device, Fiber Optic, TC907-22

NGAC TC907-92

NGAC TC907-92

Thermally Conductive and Electrically Insulating Adhesive

ElectronicBeth VenutiJune 13, 2018Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, TC907-92

NGAC TC907-40

NGAC TC907-40

Flexible, Thermally Conductive and Electrically Insulating Adhesive

ElectronicBeth VenutiJune 13, 2018Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, TC907-40

NGAC TC907-09

NGAC TC907-09

Thermally Conductive and Electrically Insulating Adhesive

ElectronicBeth VenutiJune 12, 2018Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, TC907-09

NGAC TC907-07

NGAC TC907-07

Thermally Conductive and Electrically Insulating Adhesive

ElectronicBeth VenutiJune 12, 2018Heat Sink, Staking, Thermally Conductive, Alumina Filled, Chip Attach, Room Temperature Curable, Electronics, NASA Outgassing, TC907-07