Thermal Management Adhesive: NGAC TC907-07
NGAC TC907-07
NGAC TC907-07 is a thermally conductive and electronically insulating epoxy adhesive; designed for assembling heat sensitive components onto printed circuit boards. It is recommended for any application requiring strong adhesive bonds and excellent thermal transfer.
NGAC TC907-07 passes NASA outgassing and weight loss requirements. This two-part adhesive develops strong, durable, high-impact bonds at room temperature which improves heat transfer while maintaining electrical insulation. It bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its CTE provides a good match for those materials over a wide temperature range.
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