NGAC P907-30 is a controlled flow encapsulant designed for microelectronics applications requiring low shrinkage and high reliability performance. This low outgassing material is designed for backfill applications in transceiver assembly where low moisture absorption and maintaining lens alignment under environmental stresses are critical.

NGAC P907-30 has been qualified for applications to protect wire bonds, bare die and other micro-electronic structural assembly applications. It has a low CTE resulting in an ultra- low shrinkage upon cure and stress to the substrates. It is highly resistant to humidity and will withstand reflow temperatures up to 260C. It bonds extremely well to ultem and other plastics, as well as, metal substrates and glass.

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