NGAC TC907-92
Thermally Conductive and Electrically Insulating Adhesive
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DESCRIPTION:
NGAC TC907-92 is a thermally conductive and electronically insulating adhesive which can be cured at room temperature. It was designed for assembling heat sensitive components onto printed circuit boards. It is recommended for any application requiring strong adhesive bonds and excellent thermal transfer.
ADVANTAGES AND APPLICATIONS:
NGAC TC907-92 provides strong and high impact bonds which improve heat transfer while maintaining electrical insulation. It bonds to a wide range of substrates including metals, glass and plastics. The NGAC TC907-92 has a low coefficient of thermal expansion and will provide excellent resistance to mismatched substrates and very low shrinkage. Additionally, the NGAC TC907-92 is highly resistant to chemicals.
NGAC TC907-92 features the following characteristics that enable ease of use.
PROPERTIES:
*All values reported below are typical values and are for reference use only. These values are not intended for use in developing specifications. Application testing under specific conditions should be performed to determine actual results and fitness for use.
COLOR (mixed): Blue
MIXED VISCOSITY, cps: 40,000
THIXOTROPIC INDEX: 1.7
SPECIFIC GRAVITY: 2.3
MIX RATIO BY WEIGHT (R/H): 100/9
HARDNESS, Shore D: 90D
OPERATING TEMPERATURE: -70 to +125˚C
THERMAL CONDUCTIVITY, W/M/°K: 0.96
CTE, in/in/°C: 25 E-06
LAP SHEAR, ALUM TO ALUM: 3000 psi
POT LIFE: 40 minutes
NASA OUTGASSING: PASSES
CURE SCHEDULE:
Temperature of 25˚C for 24 hours
OR
Temperature of 65˚C for 2-4 hours
For additional information or assistance, please call 978-436-9600.