NGAC P910-04
Low Shrinkage and Controlled Flow Adhesive
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DESCRIPTION:
NGAC P910-04 is a high viscosity, controlled flow encapsulant designed for microelectronics applications requiring low shrinkage and high reliability performance.
ADVANTAGES AND APPLICATIONS:
Uses include protecting wire bonds and bare die and other micro-electronic structural assembly applications. NGAC P910-04 has a low CTE resulting in low shrinkage upon cure and no stress to substrates. It is highly resistant to humidity and will withstand reflow temperatures up to 260°C.
NGAC P910-04 features the following characteristics that enable ease of use.
STORAGE REQUIREMENTS:
NGAC P910-04 is packaged in pre-mixed and frozen syringe. It must be shipped in dry ice* and stored in a freezer. The optimum storage temperature is -60 ̊C to -70 ̊C and the minimum storage temperature recommended is -57 ̊C.
*Temperature during shipment should be maintained at -40 ̊C or colder with dry ice.
Shelf life of each lot will be exactly 6 months from date of manufacture with storage at -57 ̊C minimum.
PROPERTIES:
*All values reported below are typical values and are for reference use only. These values are not intended for use in developing specifications. Application testing under specific conditions should be performed to determine actual results and fitness for use.
COLOR (mixed): Black
VISCOSITY, cps (CP52, 1 rpm 25C): 300,000
SPECIFIC GRAVITY: 1.80
HARDNESS, Shore D: 95D
GLASS TRANSITION, Tg : 130°C
CTE, ppm/°C:
Alpha1, -40 to 100°C: 20
Alpha2, 150 to 220°C: 68
OPERATING TEMPERATURE: -40 to +260˚C
WORKING LIFE***: 1.5 - 3 hours
***Working life is subjective to application requirements.
CURE SCHEDULE:
Temperature of 100˚C for 30 minutes PLUS 150˚C for 45 minutes
OR
Temperature of 150˚C for 45 minutes
For additional information or assistance, please call 978-436-9600.