NGAC P907-30MOD1
Low Shrinkage and Controlled Flow Adhesive
To request a FREE sample of NGAC P907-30MOD1, complete the form or email us directly at info@nextgenadhesives.com.
DESCRIPTION:
NGAC P907-30MOD1 is a high viscosity, controlled flow encapsulant designed for microelectronics applications requiring low shrinkage and high reliability performance.
ADVANTAGES AND APPLICATIONS:
Uses include protecting wire bonds and bare die and other micro-electronic structural assembly applications. NGAC P907-30MOD1 has a low CTE resulting in low shrinkage upon cure and no stress to substrates. It is highly resistant to humidity and will withstand reflow temperatures up to 260°C.
NGAC P907-30MOD1 features the following characteristics that enable ease of use.
STORAGE REQUIREMENTS:
NGAC P907-30MOD1 is packaged in pre-mixed and frozen syringe. It must be shipped in dry ice and stored in a freezer at -40°C or colder.
Shelf life of each lot will be exactly 6 months from date of manufacture with storage at -40°C Minimum.
PROPERTIES:
*All values reported below are typical values and are for reference use only. These values are not intended for use in developing specifications. Application testing under specific conditions should be performed to determine actual results and fitness for use.
COLOR (mixed): Black
SPECIFIC GRAVITY: 1.80
HARDNESS, Shore D: 95D
OPERATING TEMPERATURE: -40 to +260˚C
GLASS TRANSITION TEMPERATURE: 120°C
WORKING LIFE***: 24 hours
***Working life is subjective to application requirements.
CURE SCHEDULE:
Temperature of 100˚C for 30 minutes PLUS 150˚C for 45 minutes
OR
Temperature of 150˚C for 45 minutes
For additional information or assistance, please call 978-436-9600.